Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device

摘要

The adhesive composition according to the present invention is characterized by including an acrylic polymer, an epoxy resin having an epoxy equivalent of 180 g/eq or less and a thermosetting agent. According to the present invention, provided are an adhesive composition which can achieve a high package reliability in a package in which a semiconductor chip being reduced in a thickness is mounted even when exposed to severe reflow conditions, an adhesive sheet having an adhesive layer comprising the above adhesive composition and a production process for a semiconductor device using the above adhesive sheet.