| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a piezoelectric vibration chip, along with a manufacturing method of a piezoelectric device, capable of suppressing CI value to a low level by preventing occurrence of stress changes caused by the difference in the linear expansion coefficient due to heat. <P>SOLUTION: The manufacturing method of a piezoelectric vibration piece includes a formation process of an element process where a piezoelectric element piece is formed from a piezoelectric substrate, and an electrode formation process in which an electrode for driving that is required for the piezoelectric element piece is formed. The electrode formation process includes a base material formation process ST11, in which a base material layer is film-formed at the point where the electrode of piezoelectric element piece should be formed; an electrode metal layer formation process ST12, in which an electrode metal layer is film-formed on the surface of the base material layer, heating precipitation processes ST13-1, ST13-2, and ST13-3 in which the metal of the base material layer is diffused in the electrode metal layer by heating and the base material layer is substantially completely precipitated on the surface of the electrode metal layer; and a precipitated metal removing process ST14 for substantially completely removing the precipitated metal layer. <P>COPYRIGHT: (C)2009,JPO&INPIT |
