| 摘要 |
PROBLEM TO BE SOLVED: To manufacture efficiently and at a low cost a stamper in which a micro-order fine structure and a nano-order fine structure are intermingled. SOLUTION: A base mold (substrate 10) has a layer of an electrodeposition resist layer 15 or a metal plating layer or a combination of these layers as a release layer, the base mold is subjected to electroforming through the release layer, and an electroformed product 20 formed by the electroforming is released from the base mold by removing the release layer to obtain a stamper 25. It is possible to accurately transfer the fine structure of the base mold on the stamper. The method leads to the sharp reduction of the manufacturing time of the stamper, and the use of the reusable base mold can reduce cost. Since film thicknesses of the electrodeposition resist layer and the metal plating layer can be adjusted, the stamper having a highly precise submicron-order fine structure can be manufactured by downsizing the electroformed product. COPYRIGHT: (C)2009,JPO&INPIT
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