| 摘要 |
A packaging substrate structure is disclosed, which at least comprises a build-up structure including a first dielectric layer, a second dielectric layer and a third dielectric layer. The second dielectric layer is disposed between the first dielectric layer and the third dielectric layer. The characteristic is that the Young's modulus of the second dielectric layer is lower then the first dielectric layer and the third dielectric layer so as to form a sandwich structure of high-low-high of Young's modulus. The packaging substrate structure of the present invention can improve the quality of the product. |
