EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A semiconductor manufacturing apparatus is provided to enhance a yield in a manufacturing process by reducing a temperature deviation and particles defects. A first and second chamber lids(112,122) are formed to cover upper ends of a first and second chamber bodies(110,120) to seal up the inside of the first and second chamber bodies. A first and second gas manifolds(116,126) are formed to supply high-temperature source gas into the inside of the first and second chamber bodies. A first and second cooling water manifolds(114,124) are formed to supply or collect cooling water the inside of the first and second chamber lids through the first and second gas manifolds. A third cooling water manifold(134) is formed to supply or collect sidewalls of the first and second chamber bodies. A first to third refrigerant circulation supply units(119,129,139) collect and cool the heated cooling water and supply the cooling water to the first to third cooling water manifolds through the cooling water supply line.