| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent a problem of a connecting failure or the like caused by stress generated to a connection part of an insulating film and an insulating substrate due to shrinkage of the insulating film by the change of temperature or humidity. <P>SOLUTION: Slits 10 are formed in the insulating film 2 in proximity to the connection parts 9 which connect the wiring ends of one of a plurality of insulating substrates 3 to the wiring ends 26 of an electrode pair 8 of the insulating film 2. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
