发明名称 SANDWICH STRUCTURE AND MOLDED PRODUCT USING IT, AND ELECTRONIC INSTRUMENT CASING
摘要 PROBLEM TO BE SOLVED: To provide a sandwich structural body excellent in lightweight properties and thin thickness properties, and to provide a molded product manufactured by integrating this sandwich structural body with other members, and by good mass productivity, and excellent in lightweight properties and thin thickness properties. SOLUTION: The sandwich structural body (III) consists of a core material (I) prepared by forming at least one structure among a honeycomb structure, an island-like structure or a structure with gap parts penetrating through in the parallel direction to the surface, and fiber-reinforced materials (II) arranged on both faces of the core material (I) and composed of a continuous reinforcing fiber (A) and a matrix resin (B). The maximum thickness of the sandwich structural body (III) is 0.3-2.0 mm. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008230235(A) 申请公布日期 2008.10.02
申请号 JP20080037043 申请日期 2008.02.19
申请人 TORAY IND INC 发明人 HONMA MASATO;TSUCHIYA ATSUKI;ISHINABE RYOICHI
分类号 B32B3/12;B32B5/00;H05K5/02 主分类号 B32B3/12
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