发明名称 WIRING STRUCTURE AND METHOD OF FORMING THE SAME
摘要 A CNT bundle is formed by growing a plurality of CNTs from opposing surfaces of contact blocks toward mutual opposing surfaces, and by contacting the CNTs so that they intersect to electrically connect with each other. Subsequently, a gap of the electrically connected CNT bundle is filled with a metal material, to thereby form a wiring being a composite state of the CNT bundle and the metal material.
申请公布号 US2008236875(A1) 申请公布日期 2008.10.02
申请号 US20080059205 申请日期 2008.03.31
申请人 FUJITSU LIMITED 发明人 NIHEI MIZUHISA;SATO SHINTARO;KONDO DAIYU;AWANO YUJI
分类号 H05K1/09;B05D5/12 主分类号 H05K1/09
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