| 发明名称 |
Direct bury splice kit |
| 摘要 |
A decoder system and a direct bury splice kit for in situ encapsulation of an electrical wire and wire connector wherein the encapsulation minimizes separating forces between the joined wires in the wire connector
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| 申请公布号 |
US2008236863(A1) |
申请公布日期 |
2008.10.02 |
| 申请号 |
US20080077267 |
申请日期 |
2008.03.18 |
| 申请人 |
KING LLOYD HERBERT;KEEVEN JAMES C;HINER WILLIAM |
发明人 |
KING LLOYD HERBERT;KEEVEN JAMES C.;HINER WILLIAM |
| 分类号 |
H02G15/113;H01R4/00;H02G15/013 |
主分类号 |
H02G15/113 |
| 代理机构 |
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代理人 |
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