发明名称 |
COPPER DIE BUMPS WITH ELECTROMIGRATION CAP AND PLATED SOLDER |
摘要 |
Embodiments of the invention include apparatuses and methods relating to copper die bumps with electromigration cap and plated solder. In one embodiment, an apparatus comprises an integrated circuit die, a plurality of copper bumps on a surface of the die, electromigration (EM) caps substantially covering a mating surface of the copper bumps capable of controlling intermetallic formation between the copper bumps and a solder, and solder plating on the EM caps capable of protecting the EM caps from oxidation prior to packaging. |
申请公布号 |
WO2008118774(A1) |
申请公布日期 |
2008.10.02 |
申请号 |
WO2008US57802 |
申请日期 |
2008.03.21 |
申请人 |
INTEL CORPORATION;ZHONG, TING;DUBIN, VALERY;BOHR, MARK |
发明人 |
ZHONG, TING;DUBIN, VALERY;BOHR, MARK |
分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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