Substrate Processing Apparatus and Manufacturing Method for a Semiconductor Device

摘要

The sizes required for maintenance are reduced and an occupying floor area is reduced. The substrate processing apparatus contains a load lock chamber 41 and a transfer chamber 24 respectively provided in order from the rear side within a case 11 ; and a processing chamber 53 provided above the load lock chamber 41 for processing wafers 1 . An opening section 27 A, and an opening and closing means 28 A for opening and closing the opening section 27 A are respectively provided in a location at the rear side of the transfer chamber 24 where the load lock chamber 41 is not arranged.