| 摘要 |
A microelectronic package includes a package substrate ( 110, 310, 410 ), a plurality of dies ( 120, 610, 630 ) arranged in a stack ( 150, 350, 450 ) above the package substrate, with a first die ( 121 ) located above the package substrate at a bottom ( 151 ) of the stack and an uppermost die ( 122 ) located at a top ( 152 ) of the stack, and a plurality of heat spreaders ( 130, 330, 430, 620 ) stacked above the first die, with a first heat spreader ( 131 ) located above the uppermost die. One of the plurality of heat spreaders is located between each pair of adjacent dies. Each one of the plurality of heat spreaders has an extending portion ( 132 ) that extends laterally beyond an edge ( 123 ) of an adjacent die, and at least one of the plurality of heat spreaders both provides electrical interconnectivity and thermal conductivity. |
