| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component including a resistive element having high heat dissipation efficiency, and to provide a method of manufacturing the same. <P>SOLUTION: The electronic component includes: a resistive element having terminal electrodes 3 to be paired and provided on opposing end side regions of an insulating substrate 2, and a resistor 4 provided on one surface of the insulating substrate 2 and connected to both of the terminal electrodes 3; and a heat dissipation member 9 for dissipating heat of the resistive element. The heat dissipation member 9 is integrally arranged on the other surface of the insulating substrate 2 opposed to the one surface thereof and on end surfaces 2B connecting the one surface of the insulating substrate 2 with the other surface thereof. The heat dissipation member 9 is integrally arranged on the other surface of the insulating substrate 2 and on the end surfaces 2B. Further, the end surfaces 2B are provided with recesses 2C where the heat dissipation members 9 are provided. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
