发明名称 COMPOSITION FOR INTERLAYER INSULATION FILM
摘要 PROBLEM TO BE SOLVED: To provide a coating for forming an insulation film which is a composition for forming an insulation film used in electronic devices and the like and gives an insulation film being excellent in film characteristics such as in dielectric constant and mechanical strength, adhesion to substrates and further in the stability of a coating liquid. SOLUTION: The composition for interlayer insulation films comprises the ingredients as described below: (A) an alkoxysilane or a hydrolysate of an acyloxysilane having at least one carbon-carbon double bond, (B) a compound having at least two carbon-carbon double bonds or carbon-carbon triple bonds in the molecule, (C) a≤16C carboxylic acid and (D) a solvent. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008231383(A) 申请公布日期 2008.10.02
申请号 JP20070077398 申请日期 2007.03.23
申请人 FUJIFILM CORP 发明人 IWATO KAORU
分类号 C08F230/08;C08F2/44;C08F238/00;C09D5/25;C09D7/12;C09D147/00;C09D149/00;C09D183/10;H01L21/312 主分类号 C08F230/08
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