| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling method for appropriately cooling a power semiconductor element and an MRI apparatus utilizing such a method. SOLUTION: When respectively cooling the plurality of power semiconductor elements by a plurality of water-cooled heat sinks (302-308), the power loss of the power semiconductor elements is respectively predicted on the basis of the output values of the plurality of power semiconductor elements, the temperature rise of the plurality of water-cooled heat sinks is respectively predicted on the basis of the predicted values of the respective power loss, and the heat resistance of the plurality of water-cooled heat sinks is respectively controlled (322-328) on the basis of the predicted values of the respective cases of temperature rise. For the plurality of water-cooled heat sinks, cooling media are supplied in parallel. The cooling media are supplied by a single pump (350). COPYRIGHT: (C)2009,JPO&INPIT
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