| 摘要 |
PROBLEM TO BE SOLVED: To provide an automatic wiring device, an automatic wiring method and an automatic wiring program for preventing conductive failure between layers without ignoring line space in designing a multi-layer semiconductor integrated circuit. SOLUTION: An automatic wiring device extends a region to be superimposed on first wiring in a first wiring layer and second wiring in a second wiring layer according to the first wiring width and/or the second wiring width in a through-hole cell for connecting the first wiring and the second wiring, and corrects the first wiring and/or the second wiring according to the extended region. COPYRIGHT: (C)2009,JPO&INPIT
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