| 摘要 |
PROBLEM TO BE SOLVED: To provide a radiation-curable adhesive composition capable of forming a composite body by easily adhering a molded body of a PVA based resin to the other article to be adhered, and capable of enhancing cutting-resistant property of the composite body after adhesion. SOLUTION: The composition contains (A) a compound represented by formula (1); (in formula (1), R<SP>13</SP>, R<SP>14</SP>and R<SP>15</SP>each independently represent a monovalent organic group, at least two of R<SP>13</SP>-R<SP>15</SP>are -R<SP>16</SP>OCOCR<SP>17</SP>=CH<SB>2</SB>, R<SP>16</SP>is a divalent 2-8C organic group, and R<SP>17</SP>is a hydrogen atom or a methyl group), (B) an alicyclic epoxy compound, (C) a compound containing at least one hydroxyl group and having a number average molecular weight of 500 or higher, and (D) an optical acid generation agent. COPYRIGHT: (C)2009,JPO&INPIT
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