Device for manufacturing semiconductor components, has radiation emission device and radiation recording device relative to semiconductor substrate arranged on same side

摘要

The semiconductor components manufacturing device has a radiation emission device (2) and a radiation recording device (3) relative to a semiconductor substrate (5) arranged on a same side. The radiation emission device for an irradiation (4), is permeable for a portion of layer of the semiconductor substrate and is provided for one of radiation reflecting structure layers (8) in the semiconductor substrate. An independent claim is also included for a method for an alignment of component structures.