| 摘要 |
An FBGA(Fine-pitch Ball Grid Array) package and a method for manufacturing the same are provided to prevent the defect due to a shortage or excess of an adhesive tape by attaching the adhesive tape on a semiconductor chip of a wafer level not a substrate. A semiconductor chip(31) has plural bonding pads(31a) which are exposed by a dielectric. An adhesive tape(33) including an ACI(Anisotropic Conductive Ink) element is attached on a bonding pad formation surface of the semiconductor chip. The semiconductor chip is attached on a substrate(35) in a face-down type by mediating the adhesive tape. The substrate has a cavity(36) and a circuit pattern. A metal wire(37) passes through the cavity of the substrate to electrically connect the bonding pad of the semiconductor chip to the circuit pattern of the substrate. A sealing member(39) seals an upper surface of the substrate including the semiconductor chip and the cavity of the substrate including the metal wire. A solder ball(41) is attached to a lower surface of the substrate.
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