发明名称 LED PACKAGE WITH DOWNWARDLY RELFECTIVE SURFACE
摘要 A LED package having a downward reflection surface is provided to increase the amount of light in a peripheral region in comparison with a center region by using an interaction between an upward light-reflecting part and a downward light-reflecting part. A LED package includes an LED chip(10), a package body(20), and a sealing member(30). The LED package is mounted on the LED chip. An upward light-reflecting part(22) is formed in a periphery of the LED chip of the LED package. A sealing member is formed in a convex shape on the package body to cover the LED chip. A downward light-reflecting part(32) is formed in a center region on the same axis as the axis of the LED chip. The downward light-reflecting part is formed by attaching a reflective material on the center region.
申请公布号 KR20080088219(A) 申请公布日期 2008.10.02
申请号 KR20070030870 申请日期 2007.03.29
申请人 SEOUL SEMICONDUCTOR CO., LTD. 发明人 JEANG, CHAN SUNG
分类号 H01L33/60;H01L33/52 主分类号 H01L33/60
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