| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dresser for a CMP processing capable of sufficiently dressing by a dressing treatment and holding grinding capability for a polishing pad for a long period of time. <P>SOLUTION: The dresser 4 is used for performing the dressing treatment for the polishing pad provided on the CMP processing device. The dresser 4 for the CMP processing is equipped with an approximately circular support surface 4b opposed to the polishing pad, three or more belt-like abrasive grain holding parts 41A-41H approximately radially extended from a central part 4c of the support surface 4b, a plurality of abrasive grain holding parallel parts 42 which are in an approximately fan-shaped area M clipped by adjacent abrasive grain holding parts 41A-41H with each other and disposed in parallel with either one of abrasive grain holding parts 41A-41H, and a belt-like abrasive grain non-holding part 43 which is in the approximately fan-shapes area M and provided respectively between one side of the abrasive grain holding parts 41A-41H and the plurality of abrasive grain holding parallel parts 42. <P>COPYRIGHT: (C)2009,JPO&INPIT |
