发明名称 MANUFACTURING METHOD OF COPPER WIRE AND COPPER WIRE COAT PEELING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a copper wire with a coat for coating an outer periphery of a copper-made wire partially peeled, and also to provide a copper wire coat peeling device. <P>SOLUTION: Green laser (laser beam 1) having an absorption rate equal to or more than a constant value to a coat and copper as a wire rod is irradiated on a coat peeled part of the copper wire 3 with an outer periphery of the wire rod made of copper in a state coated with a coat, and the coat is sublimated by laser heat. At the coat peeled part corresponding to the laser irradiated part, the wire rod is structured to be exposed without a residue of the coat, and without damages to the wire. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2008234917(A) 申请公布日期 2008.10.02
申请号 JP20070070689 申请日期 2007.03.19
申请人 MITSUBISHI ELECTRIC CORP 发明人 IKUTA HIRONARI;TAKENO YOSHIMIZU;NAKAJIMA TAKASHI
分类号 H01B13/00;B23K26/12;B23K101/34;B23K103/12;H02G1/12 主分类号 H01B13/00
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