Described herein are microelectronic packages including a plurality of bonding fingers and multiple integrated circuit chips, at least one integrated circuit chip being mounted onto the bonding fingers. According to various embodiments of the present invention, mounting the integrated circuit chip onto the bonding fingers may reduce the pin-out count by allowing multiple integrated circuit chips to be interconnected within the same microelectronic package. Other embodiments may be described and claimed.
申请公布号
WO2008067249(A3)
申请公布日期
2008.10.02
申请号
WO2007US85531
申请日期
2007.11.26
申请人
MARVELL WORLD TRADE LTD.;LIU, CHENGLIN;LIOU, SHIAN-MING