| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide laminated film having a low electric permittivity, high elongation modulus and tensile fracture strain, and high mechanical strength, and a printed board using the same. SOLUTION: The polyimide laminated film has a polyimide film (A) having a fluorine content of less than 5 mass% and a polyimide film (B) having a fluorine content of 5 mass% or more deposited on at least one side of the polyimide film (A). The printed board has a metal layer deposited on the surface of the polyimide film (B) in the polyimide laminated film. COPYRIGHT: (C)2009,JPO&INPIT |
