METAL-POLISHING LIQUID AND POLISHING METHOD

摘要

A metal-polishing liquid used for chemical-mechanical polishing of a conductor film of copper or a copper alloy in a process for manufacturing a semiconductor device, the metal-polishing liquid comprising: (1) an amino acid derivative represented by the formula (I); and (2) a surfactant, wherein, in the formula (I), R¹ represents an alkyl group having 1 to 4 carbon atoms and R² represents an alkylene group having 1 to 4 carbon atoms.