| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of fracturing a semiconductor substrate, in which a uniform force is applied to all the fracturing grooves in fracturing the semiconductor substrate, and to provide a method of fracturing a solar cell and the solar cell. <P>SOLUTION: In the method of fracturing a substrate, the dividing grooves 8 are formed so as not to become parallel to the cleavage planes of the semiconductor substrate 1, and the semiconductor substrate 1 is bent along the dividing grooves 8, thereby fracturing the semiconductor substrate 1 along the dividing grooves 8. <P>COPYRIGHT: (C)2009,JPO&INPIT |
