| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a CMP (Chemical Mechanical Polishing) pad conditioner capable of improving abrasive grain fixing strength, preventing aggregation of slurry and preventing elution of metals. <P>SOLUTION: Abrasive grains 4 are arranged on base metal 3 formed by stainless steel, etc. and the abrasive grains 4 are electrodeposited and fixed by a nickel plating layer 5. Parts having the grain diameters ≥55% and ≤80% of the abrasive grains 4 are buried in the nickel plating layer 5. A water-repelling coat 6 is formed on an upper surface of the nickel plating layer 5. The water-repelling coat 6 is a composite plating layer made of nickel and water-repelling resin. Content of the water-repelling resin for forming the water-repelling coat 6 is ≥45 vol.% and ≤80 vol.% in relation to the whole volume of the water-repelling coat 6. <P>COPYRIGHT: (C)2009,JPO&INPIT |
