| 摘要 |
<P>PROBLEM TO BE SOLVED: To relate to an apparatus mounting method of a chip LED loading substrate, and to provide an apparatus mounting method of a chip LED loading substrate that is without light leakage from small openings for display of a faceplate, when a plurality of chip LEDs are arranged and mounted on a printed substrate. <P>SOLUTION: In an apparatus mounting method of a chip LED loading substrate, the chip LED-loaded substrate in which a plurality of low-profile chip LEDs, having a height of 2 mm or smaller is mounted at regular intervals is arranged in parallel to a faceplate of an apparatus, in which small openings for display corresponding to each chip LED are provided to mount the chip LED-loaded substrate to the apparatus. The small openings for display are formed to be smaller than the chip LED. An angle α between the upper center of the chip LED and the center of the small opening for display of a chip LED adjacent to the chip LED is limited to a range of 10 to 15 degrees. The pitch P of the chip LED is obtained, and a height H from the upper side of the chip LED to the faceplate, which is calculated by a formula H=P×tanα, is used to mount the chip LED-mounted substrate to the apparatus. <P>COPYRIGHT: (C)2009,JPO&INPIT |
