发明名称 DIP-MOLDED PRODUCT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a dip-molded product low in surface electrical resistivity and freely controllable in surface electrical resistivity. <P>SOLUTION: The dip-molded product provided by the present invention comprises a dip-molded product made from a conjugated diene rubber and a low-electrical resistivity layer formed on the surface thereof and comprising a polyether copolymer prepared by the copolymerization of 50-99.9 mol% ethylene oxide, 0.1-15 mol% unsaturated epoxide, and 0-35 mol% other oxirane compounds copolymerizable therewith. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2008231205(A) 申请公布日期 2008.10.02
申请号 JP20070071090 申请日期 2007.03.19
申请人 NIPPON ZEON CO LTD 发明人 TSUKADA AKIRA
分类号 C08J7/04 主分类号 C08J7/04
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