发明名称 Package for mounting a semiconductor chip of ultra-high frequency
摘要 A semiconductor chip, which operates in a range of ultra-high frequency, is mounted on a package including an insulation layer on which input and output conductive patterns are formed. A metalized layer and via holes filled with conductive material are provided in the insulation layer to adjust the characteristic impedance of the conductive patterns.
申请公布号 US4890155(A) 申请公布日期 1989.12.26
申请号 US19880184775 申请日期 1988.04.22
申请人 发明人
分类号 H01L23/04;H01L23/02;H01L23/66 主分类号 H01L23/04
代理机构 代理人
主权项
地址