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发明名称
GETTERING METHOD FOR SEMICONDUCTOR WAFER
摘要
申请公布号
JPH0234932(A)
申请公布日期
1990.02.05
申请号
JP19880185996
申请日期
1988.07.25
申请人
SONY CORP
发明人
NODA SANEYA
分类号
H01L21/322;H01L21/265
主分类号
H01L21/322
代理机构
代理人
主权项
地址
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