| 摘要 |
A substrate treating apparatus for treating substrates with a treating liquid includes a treating tank having an inner tank for storing the treating liquid, and an outer tank for collecting the treating liquid overflowing the inner tank. A supply pipe interconnects the inner tank and the outer tank for circulating the treating liquid. A first branch pipe is shunted from the supply pipe, and a separator is mounted on the first branch pipe for separating deionized water and a solvent in the treating liquid, and discharging the deionized water. A second branch pipe interconnects positions upstream and downstream of the separator, and a deionized water remover is mounted on the second branch pipe for adsorbing and removing deionized water from the treating liquid. An injection pipe is connected to the supply pipe for injecting deionized water in a position downstream of the separator. A solvent injector injects the solvent into the injection pipe. A controller carries out a deionized water cleaning process for supplying deionized water from the injection pipe and cleaning the substrates inside the cleaning tank with deionized water, then a replacing process for injecting the solvent from the solvent injector and replacing the deionized water with the solvent, a separating and removing process for switching to the first branch pipe and causing the separator to remove the deionized water from the treating liquid, and an adsorbing and removing process for switching to the second branch pipe and causing the deionized water remover to adsorb and remove the deionized water from the treating liquid.
|
