HIGHLY INTEGRATED WAFER BONDED MEMS DEVICES WITH RELEASE-FREE MEMBRANE MANUFACTURE FOR HIGH DENSITY PRINT HEADS

摘要

A MEMS(Micro-Electromechanical System) type inkjet print head is provided to control the deposition of oxide by manufacturing a driver component separately from a MEMS component. A MEMS type inkjet print head comprises a driver component(110), a MEMS component, a bonding feature(124), and a nozzle plate(114). The MEMS component, individually manufactured by the driver component, includes an aperture free fluid membrane. The bonding feature couples the driver component with the MEMS component operatively. The nozzle plate is attached to the MEMS component.