METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

摘要

A method for manufacturing a printed circuit board is provided to reduce a cost and improve the reliability of a product by changing a separation method for a carrier and a substrate. A method for manufacturing a printed circuit board includes the steps of: forming an adhesive layer of which adhesive force is changed according to heat, on the surface of a carrier(S110); forming a circuit pattern on the surface of the adhesive layer(S120); compressing the carrier to an insulating layer so that the circuit pattern faces the insulating layer(S140); and separating the carrier from the insulating layer by supplying heat to the adhesive layer to reach a predetermined temperature(S150).