发明名称 LIGHT EMITTING DEVICE AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a light emitting device whose connection reliability can be improved by holding insulation between a mounting substrate keeping its radiation and its manufacturing method. <P>SOLUTION: The light emitting device 10 has a light emitting element 40 and a substrate 20 for mounting the light emitting element 40. The substrate 20 has an insulating plate 21 on a lower surface of which a lower surface electrode 232a connecting with a connection electrode P of the mounting board B is formed and a conductive radiation plate 22 which is formed on the insulating plate 21. For the insulating plate 21, an insulating surrounding wall 211 closing the circumferential surface of the radiation plate 22 is located around the whole surrounding surface of the insulating plate 21 on which a solder fillet F for conducting between the connection electrode P of the mounting substrate B and the lower surface electrode 232a is formed when connecting with the mounting substrate B. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008235764(A) 申请公布日期 2008.10.02
申请号 JP20070076353 申请日期 2007.03.23
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SASAKI YOHEI;OKURA KANICHI
分类号 H01L33/32;H01L33/56;H01L33/60;H01L33/62;H01L33/64 主分类号 H01L33/32
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