| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic device with excellent airtight sealing properties by preventing a bonding material from being mechanically broken by stress resulting from inhibition of thermal expansion of the bonding material at a chamfered portion of a lid. <P>SOLUTION: A lid 2 has a chamfered ridge portion between the periphery of the lower surface and the side surface, and the area from the chamfered portion 2a to the periphery of the lower surface is bonded to a bonding area of an insulating base 1 through a bonding material 6. The insulating base 1 has a step 1c, the height of which becomes lower toward the outside from the recess 1a side, at a portion of the bonding area facing the chamfered portion 2a of the lid 2. The bonding material 6 located on the step 1c is not in contact with the bottom surface of the step 1c or is in contact with the bottom surface of the step 1c so as not to protrude from a region facing the chamfered portion 2a. The bonding material 6 is allowed to thermally expand to relieve stress at the step 1c, which prevents the bonding material 6 from being mechanically broken, thereby enhancing the reliability of airtight sealing. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
