| 摘要 |
PROBLEM TO BE SOLVED: To prevent the problem that conductive paste flows into gaps of a woven fabric during thermal pressing in a process of filling the conductive paste into a prepreg material that has the glass woven fabric as a reinforcing material and realizes conduction between layers. SOLUTION: The problem is solved through the use of a wiring board material. The wiring board material comprises a prepreg material, having the glass woven fabric 1 as a reinforcement material; and conductive paste 2 which is filled into a plurality of through holes that are made in the prepreg material thickness direction. In the wiring board material, at least one of the distances between adjacent warpages and between adjacent wefts within the surface of the woven fabric is one tenth the diameter of the through holes or smaller. The use of such a wiring board material would enable holding all conductive paste within the wiring board material surface by the woven fabric during the thermal pressing and eliminates the paste from flowing. COPYRIGHT: (C)2009,JPO&INPIT |
