| 摘要 |
PROBLEM TO BE SOLVED: To provide a washing method having no occurrence fear of particles after washing and capable of washing a constituent member at a low cost in a short time. SOLUTION: The washing method for removing an adherent from the surface of the constituent member of the film forming apparatus installed in the treatment atmosphere of the film forming apparatus includes plasma etching treatment for reducing the adhesion force of the adherend and the constituent member and washing treatment for washing off the adherend reduced in the adhesion force with the constituent member by the plasma etching treatment. COPYRIGHT: (C)2009,JPO&INPIT
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