ELECTRONIC DEVICE, ELECTRONIC EQUIPMENT IN WHICH ELECTRONIC DEVICE IS PACKAGED, ARTICLE TO WHICH ELECTRONIC DEVICE IS MOUNTED, AND ELECTRONIC DEVICE MANUFACTURING METHOD

摘要

An electronic device etc. in which bending stress to a circuit chip is reduced and the disconnection of a conductor pattern is avoided. The device is provided with a base (11), the conductor pattern (12) wired on the base, the circuit chip (13) connected electrically with the conductor pattern (12), a reinforcing body (16) which is located on the base (11) surrounding the circuit chip (13), which has an annular external shape and which has an internal structure having supporters (16b) extending in the direction of the thickness of the base (11) dispersed in a predetermined base material (16a), and a sealing body (15a) which fills inside of the reinforcing body (16) to cover the top of the circuit chip (13) to seal the circuit chip (13) on the base (11).