| 摘要 |
An adhesive composition, an adhesive sheet containing an adhesive comprising the composition, and a method for preparing a semiconductor device by using the composition are provided to prevent the generation of crack or separation of an adhesion interface even if exposed to the severe reflow condition. An adhesive composition comprises an acrylic polymer; an epoxy resin having an acryl equivalence of 180 g/eq or less; and a curing agent. Preferably the curing agent is a compound containing at least two phenolic hydroxyl groups and having a phenolic hydroxyl equivalence of 103 g/eq or less. Preferably the acrylic polymer has a weight average molecular weight of 10,000-2,000,000. |
