发明名称 APPARATUS FOR TREATING SUBSTRATE WITH NOZZLES AND CONTROL METHOD FOR NOZZLES THEREOF
摘要 A substrate processing apparatus including a plurality of nozzles and a nozzle control method are provided to supply uniformly chemicals by adjusting a rotary angle between a selected nozzle and a substrate. A substrate is loaded on a spin head(120). A nozzle unit(110) includes a plurality of nozzles for supplying chemicals to a substrate. The nozzles are installed at one rotary shaft. The nozzle unit rotates independently each of the nozzles according to a processing state. A selection unit selects one nozzle from the nozzles according to the processing state. A driving unit(114) rotates the rotary shaft to supply the chemicals from the selected nozzle to the substrate. A control unit controls the selection unit to select the nozzle, controls a rotary angle of the rotary shaft to supply uniformly the chemicals to the entire surface of the substrate.
申请公布号 KR20080088191(A) 申请公布日期 2008.10.02
申请号 KR20070030778 申请日期 2007.03.29
申请人 SEMES CO., LTD. 发明人 KIM, JU WON;CHOI, JEUNG BONG
分类号 H01L21/304 主分类号 H01L21/304
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