| 摘要 |
PROBLEM TO BE SOLVED: To provide a versatile heat dissipation structure of electronic components of improved heat dissipation characteristics, as well as a semiconductor device. SOLUTION: Relating to the heat dissipation structure of an electronic component 35 that is mounted on a wiring substrate 31, a heat insulating material 33 is provided on the upper part of the wiring substrate 31, and a first heatsink 34 is provided on the upper part of the heat insulating material 33. The electronic component 35 is placed on the upper part of the first heatsink 34. COPYRIGHT: (C)2009,JPO&INPIT |
