| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a short circuit caused by solder reflowing in a semiconductor device. <P>SOLUTION: The semiconductor device comprises a semiconductor chip 2 having a plurality of pads 2c formed on a main plane 2d, a chip component 3 having a connection terminal 3d formed at each end, a module substrate 4 having the semiconductor chip 2 and the chip component 3 mounted thereto, a solder connecting member 5 for connecting the chip component 3 and the substrate side terminal 4a of the module substrate 4 with solder, a gold wire 8 for connecting the pad 2c of the semiconductor chip 2 with the substrate side terminal 4a of the corresponding module substrate 4, and a sealing member covering the semiconductor chip 2, the chip component 3, the solder connection member 5, and the gold wire 8, and comprising a low modulus resin as an insulation silicone resin, a low modulus epoxy resin or the like. The device is prevented from the flowing out of the solder caused by the reflow of the solder at the solder connection member 5. <P>COPYRIGHT: (C)2009,JPO&INPIT |
