| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for storing electronic components where an inspection terminal having a sufficient area is formed, and to provide an electronic device using the package, and an electronic device manufacturing method, concerning the package for storing the thin electronic components. SOLUTION: The package for storing the electronic components includes: an insulating base body 101 having a first recession 102 formed on an upper surface in order to store the first electronic component 107, a second recession 103 formed on a lower surface in order to store the second electronic component 108, and a lid body mounting frame part 104 where a lid body 112 for sealing the first recession 102 is mounted; the terminal for inspection 109 formed on the bottom surface of the second recession 103 in order to measure the electric property of the first electronic component 107 when the component 107 is stored; and a wiring conductor 110 for connecting the first electronic component 107 to the inspection terminal 109 when the first electronic component 107 is stored. COPYRIGHT: (C)2009,JPO&INPIT |
