| 摘要 |
PROBLEM TO BE SOLVED: To improve the positioning accuracy in transferring a substrate to be treated to a substrate support, and contrive the improvement of the uniformity of film formation and positioning reproducibility and the improvement in the reliability of transfer work. SOLUTION: In a heat treatment method of heat-treating the substrate w to be treated, the substrate w is transferred between a storage container 21 capable of storing a plurality of substrates w in multiple steps and a substrate support 10 capable of supporting many substrates w in multi steps by a transfer mechanism 24 having a transfer plate 23, and the substrate w is conveyed into a heat treatment furnace 3, together with the substrate support 10. In the heat treatment method, there is provided a positioning groove 34 in which the substrate w goes on the transferring plate 23, and the transfer plate 23 is moved forward and upward to allow one side part of the substrate w, to enter the positioning groove 34 and support the other side part, in a state of being mounted on the edge of the positioning groove 34. After that, the transfer plate 23 is accelerated and retreated, and thereby the substrate w is dropped into the positioning groove 34 by an inertial force to be positioned. COPYRIGHT: (C)2009,JPO&INPIT
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