| 摘要 |
PROBLEM TO BE SOLVED: To provide electronic equipment with a printed-wiring board capable of more improving a packaging density. SOLUTION: A printed-wiring board module 20 has a circuit board (a mother board) 21, a first board 22, a second board 23, and a third board 24. The third board 24 has an opening section 25 formed extensively over an underside 24b from a top face 24a and an IC chip 32 is mounted on the underside 22b of the first board 22 so as to be placed in the space formed by the opening section 25. Since an electronic part mounted on the underside 22b of the first board 22 is placed in the space formed by not only laminating a plurality of boards but also holding the third board 24 with the opening section 25 by the circuit board 21 and the first board 22, more electronic parts can be loaded on the printed-wiring board module 20, and the packaging density can be improved. COPYRIGHT: (C)2009,JPO&INPIT
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