发明名称 |
Microelectronic die having nano-particle containing passivation layer and package including same |
摘要 |
A microelectronic die and a package including the die. The die comprises a die substrate including a base and a die passivation layer disposed on the base. The die passivation layer includes a nanocomposite including a matrix and nanoparticles dispersed within the matrix.
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申请公布号 |
US2008237822(A1) |
申请公布日期 |
2008.10.02 |
申请号 |
US20070731524 |
申请日期 |
2007.03.30 |
申请人 |
RARAVIKAR NACHIKET R;PADIYAR SUMANT;PATEL NEHA |
发明人 |
RARAVIKAR NACHIKET R.;PADIYAR SUMANT;PATEL NEHA |
分类号 |
H01L23/29 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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