This invention claims benefit of prior pending provisional application serial number 60/891,360, filed 2007.02.23. This invention relates to the field of integrated circuit fabrication. More particularly, this invention relates to measuring the temperature at the substrate plane during photoresist exposure of the substrate, and correlating temperature with overlay accuracy.
申请公布号
WO2008118780(A1)
申请公布日期
2008.10.02
申请号
WO2008US57833
申请日期
2008.03.21
申请人
KLA-TENCOR CORPORATION;DIBIASE, TONY;SUN, MEI, H.;WILTSE, MARK