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发明名称
高频整合调整器
摘要
在以提升高频匹配调整器的信赖性为目的,而形成对高频产生装置与负载装置之匹配作调整之匹配调整电路的高频匹配调整器中,具备有:筐体;和匹配调整电路之电性构件;和将电性构件之端子作连接的配线材,使电性构件,藉由配线材而从筐体浮起。
申请公布号
TW200840132
申请公布日期
2008.10.01
申请号
TW097100837
申请日期
2008.01.09
申请人
国立大学法人东京工业大学
发明人
冲野晃俊;宫原秀一;景安泰千
分类号
H01P5/08(2006.01)
主分类号
H01P5/08(2006.01)
代理机构
代理人
林志刚
主权项
地址
日本
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