发明名称 |
METHOD OF FABRICATING LIGHT EMITTING DIODE |
摘要 |
A method for manufacturing a light emitting diode is provided to effectively emit light propagating toward a substrate to the outside by rubbing a superhard powder against a sidewall of the light emitting diode. A substrate(100) is prepared. A compound semiconductor layer including a lower semiconductor layer(210), an active layer(220), and an upper semiconductor layer(230) is formed on the substrate. The substrate with the compound semiconductor layer is diced in a chip unit. A surface of a sidewall of the diced substrate is rubbed with a superhard powder. The sidewall surface treatment includes a procedure for mixing the superhard powder with a solvent, a procedure for placing the diced substrate in an ultrasonic reactor, and a procedure for inputting the superhard powder mixed with the solvent into the ultrasonic reactor and then activating the superhard powder to perform a surface treatment of the sidewall surface of the substrate.
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申请公布号 |
KR20080087420(A) |
申请公布日期 |
2008.10.01 |
申请号 |
KR20070029631 |
申请日期 |
2007.03.27 |
申请人 |
SEOUL OPTO DEVICE CO., LTD. |
发明人 |
YOON, YEO JIN;KIM, CHANG YEON |
分类号 |
H01L33/20;H01L33/02 |
主分类号 |
H01L33/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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